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Advanced Heat Spreaders for the Most Demanding Applications
Designed for extreme performance, our thermal management solutions power
high-density computing, aerospace, and energy systems
OUR MISSION
Xtherma pioneers ultra-conductive heat spreaders, enabling HPC, aerospace, and power electronics to run cooler, faster, and more efficiently through cutting-edge thermal innovation.
OUR SOLUTIONS
Delivering Advanced Thermal
Management Solutions Globally
HIGH-PERFORMANCE HEAT SPREADERS FOR
HPC & AI DATA CENTERS
Xtherma’s ultra-conductive heat spreaders efficiently dissipate heat, reducing temperatures by up to 15°C, enhancing performance, and cutting cooling energy consumption.
ADVANCED THERMAL MANAGEMENT FOR AEROSPACE & POWER ELECTRONICS
Xtherma’s lightweight, high-conductivity heat spreaders improve thermal performance while reducing weight, ensuring higher reliability and energy efficiency in demanding environments.
SCALABLE, COST-EFFECTIVE MANUFACTURING FOR
NEXT-GEN ELECTRONICS
Xtherma’s proprietary batch-based, automated manufacturing process ensures scalability, cost-efficiency, and high yield rates, making next-gen thermal solutions commercially viable.
XTHERMA IN NUMBERS
1,500 W/mK
5-7x higher thermal conductivity than conventional heat spreaders for maximum efficiency.
Up to 15°C Cooler
Enhances GPU, AI, and power electronics performance by reducing thermal bottlenecks.
50% Lighter
Delivers high thermal efficiency with reduced weight, ideal for aerospace and power electronics.
3-5X Faster Heat Dissipation
Minimizes heat buildup, preventing performance throttling in high-power applications.