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ADVANCED THERMAL PERFORMANCE
At Xtherma, we develop ultra-conductive heat management systems designed to enhance cooling efficiency in high-performance computing (HPC), aerospace, and power electronics. Our solution enables faster heat dissipation, lower operating temperatures, and increased system reliability
HOW IT WORKS
• High Thermal Conductivity – Enables efficient heat transfer, reducing thermal bottlenecks.
• Lightweight & Scalable – Designed for energy-efficient, high-power applications.
• Enhanced Reliability – Performs across extreme temperatures and high-power densities.
INDUSTRY APPLICATIONS
✔ HPC & AI Data Centers – Optimizing cooling for
GPUs, AI processors, and cloud infrastructure.
✔ Aerospace – High-performance thermal management
for mission-critical electronics.
✔ Power Electronics – Improving heat dissipation for
next-gen EVs, industrial systems, and beyond.
Xtherma is redefining how industries manage heat.
Get in touch to learn how our solutions can power your innovations.