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Technology & R&D – Next-Generation Thermal Innovation

At Xtherma, we are pioneering ultra-conductive heat spreaders that set new benchmarks for thermal management in high-performance computing (HPC), aerospace, and power electronics. Our R&D focuses on enhancing thermal conductivity, durability, and manufacturability to meet the growing demands of next-generation electronics.

How Our Technology Works

Our advanced heat spreaders leverage high thermal conductivity (~1,500 W/mK) to efficiently transfer heat, significantly reducing hot spots and thermal resistance. This enables faster cooling, better energy efficiency, and longer hardware lifespan for mission-critical applications.

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Key Features:

✔ Superior Heat Dissipation – Transfers heat 3- 5X faster than conventional materials, preventing performance throttling.


✔ Lightweight & Scalable – 50% lighter than copper, ideal for aerospace and weight-sensitive applications.


✔ Extreme Reliability – Withstands -40°C to +125°C for enhanced performance in harsh environments.


✔ Cost-Effective Manufacturing – Batch-based production for high scalability and industry adoption.

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Industry Validation & Testing

We rigorously test our heat spreaders for thermal performance, mechanical integrity, and long-term durability under real-world conditions. Validation includes:

  • Thermal Cycling (-40°C to +125°C) – Ensuring reliability across extreme conditions.

  • Mechanical Stress & Strain Tests – Verifying material integrity under operational loads.

  • TIM Compatibility Testing – Optimizing performance with various thermal interface materials.

  • Scalability & Yield Optimization – Targeting >90% manufacturing yield efficiency.

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Why Xtherma’s Technology is a Game-Changer

Unlike traditional solutions like copper heat spreaders, advanced ceramics, or liquid cooling, our technology offers:
✔ Higher Thermal Conductivity – Reduces temperature buildup in HPC, AI clusters, and power electronics.


✔ Lighter, More Efficient Designs – Enhancing mobility and energy savings in aerospace and EVs.


✔ Seamless Integration – Designed to fit into existing thermal management architectures.

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Xtherma is redefining the future of thermal management with scalable, high-performance solutions. Contact us today to explore partnerships or investment opportunities!

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