HIGH-PERFORMANCE
THERMAL MANAGEMENT
CRITICAL APPLICATIONS
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At Xtherma, we design and manufacture ultra-conductive heat spreaders engineered to address the growing thermal challenges in high-performance computing (HPC), aerospace, and power electronics. Our patented advanced materials enable superior thermal conductivity (~1,500 W/mK), lightweight integration, and scalable manufacturing, setting a new industry standard for cooling efficiency and reliability.
Our solutions are designed to deliver lower operating temperatures, extended hardware lifespan, and improved power efficiency, making them ideal for industries where heat dissipation is a critical bottleneck.
01
HPC & AI Data Centers – Unlocking Performance with
Next-Gen Cooling
Xtherma’s Solution:
✔ Our heat spreaders offer ~1,500 W/mK thermal conductivity, transferring heat 3-5X faster than traditional materials, significantly improving heat dissipation and stability.
✔ Reduces component temperatures by up to 15°C, allowing higher sustained performance and longer system lifespan.
✔ Compatible with standard GPU and CPU thermal architectures, making integration seamless for data centers, AI clusters, and high-performance computing environments.
The Problem:
• AI processors, GPUs, and cloud infrastructure generate extreme heat due to increased power density and processing speeds, leading to thermal throttling, higher cooling costs, and performance degradation.
• Traditional materials like copper (400 W/mK) and aluminum (200 W/mK) struggle to dissipate heat efficiently, limiting computational efficiency and increasing operational expenses.
The global HPC cooling market is projected to exceed $10B+ by 2030, driven by AI and cloud expansion. Xtherma’s solutions provide a cost-effective, scalable advantage in this rapidly growing sector.
02
Aerospace & Defense – Lightweight, High-Reliability Cooling Solutions
Xtherma’s Solution:
✔ Our lightweight heat spreaders offer a 50% weight reduction compared to copper while maintaining high thermal performance.
✔ Designed to withstand extreme conditions (-40°C to +125°C), ensuring long-term reliability for satellites, avionics, and military-grade electronics.
✔ Enables higher energy efficiency in propulsion, onboard electronics, and surveillance systems, reducing heat-related failures.
The Problem:
• Extreme temperature fluctuations in space and defense applications require materials that can maintain structural integrity and thermal performance.
• Traditional metal-based heat spreaders add unnecessary weight, increasing fuel costs and reducing payload efficiency.
The global aerospace thermal management market is expected to grow at 6.5% CAGR, with increasing demand for lightweight, high-performance materials in space exploration and defense systems.
03
Power Electronics & EVs – Thermal Solutions for Next-Gen Energy Systems
The Problem:
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EV batteries, inverters, and industrial power systems require efficient heat dissipation to maintain optimal performance.
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Overheating leads to reduced battery life, lower energy efficiency, and increased failure rates in EVs, renewable energy, and industrial automation.
Xtherma’s Solution:
✔ 3-5X faster heat dissipation for more efficient power conversion.
✔ Extended battery life by reducing thermal strain on high-voltage components.
✔ Scalable production for seamless integration into EV platforms and industrial power grids.
The EV and power electronics market is forecasted to reach $200B+ by 2030, with thermal management being a key constraint in system performance and adoption. Xtherma provides a scalable, manufacturable solution for this challenge.
04
Industrial Automation &
Telecom – Optimizing
High-Density Systems
Xtherma’s Solution:
• Our lightweight heat spreaders offer a 50% weight reduction compared to copper while maintaining high thermal performance.
• Designed to withstand extreme conditions (-40°C to +125°C), ensuring long-term reliability for satellites, avionics, and military-grade electronics.
• Enables higher energy efficiency in propulsion, onboard electronics, and surveillance systems, reducing heat-related failures.
The Problem:
• Extreme temperature fluctuations in space and defense applications require materials that can maintain structural integrity and thermal performance.
• Traditional metal-based heat spreaders add unnecessary weight, increasing fuel costs and reducing payload efficiency.